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Let’s take the
yes, but…
out of your
design process.

 

Bond3D might not be the first in industrial 3D printing. But we are absolutely the first to print real functional parts from PEEK for critical applications. Our production process retains all the great properties of the PEEK base material. That solves a lot of engineering challenges. So let’s put an end to ‘yes, but’ and start thinking ‘yes, and’.

Talk to us

Let’s take the
yes, but…
out of your
design process.

 

BOND3D might not be the first in industrial 3D printing. But we are absolutely the first to print real functional parts from PEEK for critical applications. Our production process retains all the great properties of the PEEK base material. That solves a lot of engineering challenges. So let’s put an end to ‘yes, but’ and start thinking ‘yes, and’.

Microns that change the conversation on engineering.

BOND3D’s unique printing technology creates 100% voidless parts. We combine the benefits of PEEK as a high-performance polymer, with the freedom of design and advantages of 3D printing.  That means making products with fewer components, less weight, and less waste. Faster and more efficiently than ever.

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Microns that change the conversation on engineering.

Bond3D’s unique printing technology creates 100% voidless parts. We combine the benefits of PEEK as a high-performance polymer, with the freedom of design and advantages of 3D printing.  That means making products with fewer components, less weight, and less waste. Faster and more efficiently than ever.

Talk to us

The advantages of high-performance polymers for the semiconductor industry.

3D printing of high-performance polymers overcomes the restrictions of conventional manufacturing. It opens up a whole new world of design and production possibilities while optimizing your Cost of Goods.

Gastight

BOND3D parts from PEEK are voidless and very well suited for complex structures that manage fluids and gas. Our printed parts can be pressurized to 100+ BAR.

Complex structures

Design and print strong functional parts with complex structures, like manifolds, which would be impossible to create with conventional methods.

Lightweight

PEEK is up to three times lighter than titanium and 40% lighter than aluminum. BOND3D printing further enhances PEEK with weight-optimized designs.

High vacuum environment

Peek is very suited for cleanroom applications. Thanks to its low outgassing it is very useful in high vacuum environments.

High mechanical strength

PEEK printed with BOND3D technology has a high mechanical strength of 95MPa, which is close to the base-material properties.

Lower failure rate

Simplify designs to reduce the failure rate and optimize up-time by reducing weak spots in designs.

Function integration

Integrate multiple parts into one, i.e. manifolds with cable routing.

 

Chemical resistant

PEEK is resistant to almost any chemical, making it the perfect material for demanding applications.

Fast time to market

Fast development, rapid prototyping, and short lead times ensure fast delivery.

Large temperature range

PEEK parts can withstand temperatures from – 40 C up to + 250 C.

 

The advantages of high-performance polymers for the semiconductor industry.

 

3D printing of high-performance polymers overcomes the restrictions of conventional manufacturing. It opens up a whole new world of design and production possibilities while optimizing your Cost of Goods.

Gastight

Bond3D parts from PEEK are voidless and very well suited for complex structures that manage fluids and gas. Our printed parts can be pressurized to 100+ BAR.

Complex structures

Design and print strong functional parts with complex structures, like manifolds, which would be impossible to create with conventional methods.

Lightweight

PEEK is up to three times lighter than titanium and 40% lighter than aluminum. Bond3D printing further enhances PEEK with weight-optimized designs.

High vacuum environment

Peek is very suited for cleanroom applications. Thanks to its low outgassing it is very useful in high vacuum environments.

High mechanical strength

PEEK printed with Bond3D technology has a high mechanical strength of 95MPa, which is close to the base-material properties.

Lower failure rate

Simplify designs to reduce the failure rate and optimize up-time by reducing weak spots in designs.

Function integration

Integrate multiple parts into one, i.e. manifolds with cable routing.

 

Chemical resistant

PEEK is resistant to almost any chemical, making it the perfect material for demanding applications.

Fast time to market

Fast development, rapid prototyping, and short lead times ensure fast delivery.

Large temperature range

PEEK parts can withstand temperatures from – 40 C up to + 250 C.

 

A real-world example of Bond3D in practice.

PEEK 3D printed manifold for Semicon. Freedom of design, leak tight, chemical resistent and usable in ultra high vacuum.
 

Surface roughness

• 2 um parallel to tracks
• 10 um perpendicular to tracks
• Post-processed (0.3 um)

Tapped thread M3
for connectors

M3 heat transfer inserts

Pull out force 1300 N

 

Pressure burst tested

120 bar

Pressure burst tested

95 MPa

Leak tight

8.7E-6 mbar l/s

Accuracy

±0.1 mm

Outgassing TOC

1.0E+10 (molecules/cm2/s)

A real-world example of BOND3D in practice.

PEEK 3D printed manifold for Semicon. Freedom of design, leak tight, chemical resistent and usable in ultra high vacuum.
 

Surface roughness

• 2 um parallel to tracks
• 10 um perpendicular to tracks
• Post-processed (0.3 um)

Tapped thread M3
for connectors

M3 heat transfer inserts

Pull out force 1300 N

 

Pressure burst tested

120 bar

Pressure burst tested

95 MPa

Leak tight

8.7E-6 mbar l/s

Accuracy

±0.1 mm

Outgassing TOC

1.0E+10 (molecules/cm2/s)

Get to know the details.

Download our detailed article on ‘pressure-controlled voidless PEEK printing’.

Download and read

At Bond3D, we develop our unique printing technology completely in-house, including system mechatronics, software, slicing technology, and process validation. We change the conversation on engineering in medical, aerospace, energy, automotive, manufacturing, and engineering applications.

About Bond3D

BOND High-Performance 3D technologies BV operates out of Enschede, the Netherlands. Founded in 2014 we have always been at the forefront of industrial 3D printing. Our patented technology is unique in its ability to produce functional parts from high-performance polymers that are certified for use in critical applications. 

About BOND3D

BOND High-Performance 3D technologies BV operates out of Enschede, the Netherlands. Founded in 2014 we have always been at the forefront of industrial 3D printing. Our patented technology is unique in its ability to produce functional parts from high-performance polymers that are certified for use in critical applications. 

At BOND3D, we develop our unique printing technology completely in-house, including system mechatronics, software, slicing technology, and process validation. We change the conversation on engineering in medical, aerospace, energy, automotive, manufacturing, and engineering applications.

Talk
to us

    Talk to us

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      OUR ADRESS

      Institutenweg 50
      7521 PK Enschede
      The Netherlands

      CONTACT US

      +31 (0)88 2663100
      info@bond3d.com

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      Go to Linkedin

      OUR ADRESS

      Institutenweg 50
      7521 PK Enschede
      The Netherlands

      CONTACT US

      +31 (0)88 2663100


      info@bond3d.com

      OUR SOCIALS

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